Two strain-state samples of GaN,labelled the strain-relief sample and the quality-improved sample,were grown by hydride vapour phase epitaxy (HVPE),and then characterized by high-resolution X-ray diffraction,photoluminescence and optical microscopy.Two strain states of GaN in HVPE,like 3D and 2D growth modes in metal-organic chemical vapour deposition (MOCVD),provide an effective way to solve the heteroepitaxial problems of both strain relief and quality improvement.The gradual variation method (GVM),developed based on the two strain states,is characterized by growth parameters' gradual variation alternating between the strain-relief growth conditions and the quality-improved growth conditions.In GVM,the introduction of the strain-relief amplitude,which is defined by the range from the quality-improved growth conditions to the strain-relief growth conditions,makes the strain-relief control concise and effective.The 300-μm thick bright and crack-free GaN film grown on a two-inch sapphire proves the effectiveness of GVM.
Wet etching has been widely used in defect evaluation for Ga-face GaN and surface roughness for N-face GaN dodecagonal pyramids has been fabricated on laser-lift-off N-face GaN by hot phosphor acid etching.The dodecagonal pyramid shows twelve facets including six{20-2-3}and six{22-4-5}planes.From cross-sectional TEM image,it is shown that the pyramid corresponds to the top of the edge dislocation.Compared with hexagonal pyramid-surface light emitting diodes(LEDs)etched by commonly used photoelectrochemical(PEC)process in KOH aqueous,the dodecagonal pyramid-surface LEDs show improved light extraction efficiency because of more facets,which effectively reduces the total internal reflection.
QI ShengLi,CHEN ZhiZhong,SUN YongJian,FANG Hao,TAO YueBin,SANG LiWen,TIAN PengFei,DENG JunJing,ZHAO LuBing,YU TongJun,QIN ZhiXin&ZHANG GuoYi State Key Laboratory for Artificial Microstructure and Mesoscopic Physics,School of Physics,Peking University,Beijing 100871,China
In order to solve the problems of GaN heteroepitaxy on sapphire substrate,some techniques were explored.Freestanding GaN substrates have been made by hydride vapor phase epitaxy(HVPE),laser lift-off(LLO),and chemical mechanical polishing techniques.Wafer bending and cracking in the HVPE growth were partly settled by pulsed flow modulation method.High-crystal quality was established for 1.2 mm thick GaN substrate by X-ray diffraction measurement,in which the full width of half maximum values were 72,110 arcsec for(102),(002)peaks.A novel micro-size patterned sapphire substrate(PSS)and a nano PSS were also fabricated.High-power vertical structure light emitting diodes(VSLEDs)have been developed by Au–Sn eutectic wafer bonding,homemade micro-area LLO,and light extraction structure preparation.The high-injection-level active region with low temperature GaN sandwiched layers was used for lowefficiency droop.The light output power of VSLED was achieved as 400 mW driven at 350 mA,and the dominant wavelength is about 460 nm.The structures and properties of strain modulated superlattices(SLs)and quantum wells as well as advanced simulation of carriers transport across the electron blocking layer were investigated in laser diodes.The hole concentration was achieved as high as1.6 9 1018cm-3in AlGaN/GaN SLs:Mg by inserting an AlN layer.High-quality AlGaN epilayers and structures were grown by MOCVD.Some device structures of UV LEDs and detectors were demonstrated.The emission wavelength of 262 nm UV LED has been successfully fabricated.At last,high-quality InN and InGaN materials for solar cell were grown by boundary-temperature-controlled epitaxy and growth-temperature-controlled epitaxy.Hall-effect measurement showed a recorded electron mobility of 3,280 cm2/(V s)and a residual electron concentration of 1.47 9 1017cm-3at 300 K.
Au/Sn solder bonding on Si substrates was used to fabricate the GaN-based vertical structure light emitting diodes (VSLEDs). The phase reaction of Au/Sn solder under different bonding conditions was investigated by the measurement of electron back scattering diffraction (EBSD), and the characteristics of VSLED were analyzed by scanning acoustic microscope (SAM), Raman scattering, current-voltage (I-V) and light output-current (L-I) curves. After the bonding process, horizontal stripes of Au/Sn phase (δ phase) and Au5Sn phase (ζ phase) were redirected to vertical stripes, and δ phase tended to move to the solder joint. Sn interstitial diffusion led to the distribution of δ phase and voids in Au/Sn solder, which could be seen in SAM and SEM images. Vertical distribution of the δ phase and ζ phase with proper voids in the Au/Sn bonding layer showed the best bonding quality. Good bonding quality led to little shift of the E2-high mode of Raman spectra peak in GaN after laser lift off (LLO). It also caused more light extraction and forward bias reduction to 2.9 V at 20 mA.
TIAN PengFei, SUN YongJian, CHEN ZhiZhong, QI ShengLi, DENG JunJing, YU TongJun, QIN ZhiXin & ZHANG GuoYi State Key Laboratory for Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China
