Three-dimensional molecular dynamics(MD)simulation was carried out to understand the mechanism of water lubrication in nanometric cutting.The water-lubricated cutting was compared with the dry cutting process in terms of lattice deformation,cutting force,heat and pressure distribution,and machined surface integrity.It was found that water molecules effectively reduce the friction between the tool and workpiece,the heat in the cutting zone and the pressure being generated on the tool surface,thus leading to prolonged tool life.Water molecules also enlarged the pressure-affected area,which decreased the roughness of the machined surface.
Molecular dynamic simulations are performed to study the nanoscratching behavior of polymers.The effects of scratching depth,scratching velocity and indenter/polymer interaction strength are investigated.It is found that polymer material in the scratching zone around the indenter can be removed in a ductile manner as the local temperature in the scratching zone exceeds glass transition temperature Tg.The recovery of polymer can be more significant when the temperature approaches or exceeds Tg.The tangential force,normal force and friction coefficient increase as the scratching depth increases.A larger scratching velocity leads to more material deformation and higher pile-up.The tangential force and normal force are larger for a larger scratching velocity whereas the friction coefficient is almost independent of the scratching velocities studied.It is also found that stronger indenter/polymer interaction strength results in a larger tangential force and friction coefficient.
