An interfacial study between molten iron and the prereduced ilmenite with carbon was conducted at different melting temperatures by the sessile droplet method.The wetting characteristics between molten iron and the prereduced ilmenites with carbon were investigated by measuring contact angle of the droplet of molten iron on the prereduced ilmenite substrate.The images of the interface were also examined by the optical microscope and SEM equipped with EDS.The volume of molten iron increased with the melting temperature increasing when titania or high-content titania slag was used as the substrate.The contact angle decreased with the melting temperature increasing and it was independent on time at constant temperature.The contact angle was positively correlated with the reduction degree of the ilmenite,but the work of adhesion was negatively correlated with it.Higher smelting temperature was beneficial to the separation of iron and Ti oxides.The permeability of molten iron into the prereduced ilmenite with carbon was more obvious with reduction degree increasing owing to the high porosity of prereduced ilmenite.
The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K.The triple line frontier,characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow.We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K.However,a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K.Our experimental results show a complicated temperature effect on the spreading kinetics.Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate.The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.
