Being a wide variety of thin-layered interconnection components in electronics packaging with relatively small scale and heterogeneous materials, conventional numerical methods may be time consuming and even inefficacious to obtain an accurate prediction for the interface behavior under mechanical and/or thermal loading. Rather than resort to a fully spatial discretization in the vicinity of this interface zone, an interface model was proposed within the framework of micropolar theory by introducing discontinuous approximation. A fracture description was used to represent the microscopic failure progress inside the interface. The micropolar interface model was then numerically implemented with the finite element method. As an application, the interface behavior of a packaging system with anisotropic conductive adhesive (ACA) joint was analyzed, demonstrating its applicability and great efficiency.
Micro-pin-fin cooler mounted on the power chip enables the heat removal to meet modern microsystem requirement.Carbon nanotubes (CNTs) have been proven as a potential material for micro-coolers due to the superior thermal conductivity,good mechanical property and so forth,and there appear various applications of CNTs in the micro-cooler technology.In the present paper,an analysis of the thermal and hydraulic characteristics of the micro-pin-fin heat sink was conducted,where air was used as the cooling medium and an impinging jet was introduced to enhance the heat transfer.Three-dimension computational fluid dynamics (CFD) simulations were carried out for micro-pin-fin coolers with various parameters,including the pin-fin size and pattern as well as the jet velocity and nozzle diameter.The flow field and thermal properties of the micro-pin-fin heat sink were obtained,and the heat removal efficiency was evaluated.
