A Ge/Si heterojunction L-shaped tunnel field-effect transistor combined with hetero-gate-dielectric(GHL-TFET) is proposed and investigated by TCAD simulation. Current–voltage characteristics, energy-band diagrams, and the distribution of the band-to-band tunneling(BTBT) generation rate of GHL-TFET are analyzed. In addition, the effect of the vertical channel width on the ON-current is studied and the thickness of the gate dielectric is optimized for better suppression of ambipolar current. Moreover, analog/RF figure-of-merits of GHL-TFET are also investigated in terms of the cut-off frequency and gain bandwidth production. Simulation results indicate that the ON-current of GHL-TFET is increased by about three orders of magnitude compared with that of the conventional L-shaped TFET. Besides, the introduction of the hetero-gate-dielectric not only suppresses the ambipolar current effectively but also improves the analog/RF performance drastically. It is demonstrated that the maximum cut-off frequency of GHL-TFET is about 160 GHz, which is 20 times higher than that of the conventional L-shaped TFET.
The effects of low-κ and high-κ spacer were investigated on the novel tunnel dielectric based tunnel field-effect transistor(TD-FET) mainly based upon ultra-thin dielectric direct tunneling mechanism. Drive currents consist of direct tunneling current and band-to-band tunneling(BTBT) current. Meanwhile, tunneling position of the TD-FET differs from conventional tunnel-FET in which the electron and hole tunneling occur at intermediate rather than surface in channel(or source-channel junction under gate dielectric). The 2-D nature of TD-FET current flow is also discussed that the on-current is degraded with an increase in the spacer width. BTBT current will not begin to play part in tunneling current until gate voltage is 0.2 V. We clearly identify the influence of the tunneling dielectric layer and spacer electrostatic field on the device characteristics by numerical simulations. The inserted Si_3N_4 tunnel layer between P+ region and N+ region can significantly shorten the direct and band-to-band tunneling path, so a reduced subthreshold slope(Ss) and a high on-current can be achieved. Above all the ambipolar current is effectively suppressed, thus reducing off-current. TD-FET demonstrates excellent performance for low-power applications.
Based on the elastic trap-assisted tunneling mechanism in high-κgate stacks,a quantum percolation tunneling current 1/fγ noise model is proposed by incorporating quantum tunneling theory into the quantum percolation model.We conclude that the noise amplitude of the PSD(Power Spectral Density)for three stages,namely the fresh device,one-layer BD(breakdown),and two-layer BD,increases from 10-22→10-14→10-8 A2/Hz.Meanwhile,the noise exponent γ for the three stages,has the 1/f2type(γ→2),1/fγ type(γ→1~2),and 1/f type(γ→1),respectively.The simulation results are in good agreement with the experimental results.This model reasonably interprets the correlation between the bi-layer breakdown and the tunneling 1/fγ noise amplitude dependence and 1/fγ noise exponent dependence.These results provide a theoretical basis for the high-κ gate stacks bi-layer breakdown noise characterization methods.
Radiation-induced 1/f noise degradation in the LM117 bipolar linear voltage regulator is studied. Based on the radiation-induced degradation mechanism of the output voltage, it is suggested that the band-gap reference subcircuit is the critical component which leads to the 1/f noise degradation of the LM117. The radiation makes the base surface current of the bipolar junction transistors of the band-gap reference subcircuit increase, which leads to an increase in the output 1/f noise of the LM117. Compared to the output voltage, the 1/f noise parameter is more sensitive, it may be used to evaluate the radiation resistance capability of LM117.
Silicon junction field effect transistors(JFETs) have been exposed to Co^(60)-rays to study radiationinduced effects on their dc characteristics and noise. The devices have been irradiated and measured at room temperature up to an accumulated 100 krad(Si) dose of radiation at a dose rate of 0.1 rad(Si)/s. During irradiation,the generation–recombination(g–r) noise increase has been observed while the dc characteristics of the transistors were kept unchanged. The increasing of the density of the same type point defects and their probability of trapping and detrapping carriers caused by irradiation have been used to explain the g–r noise amplitude increase, while the g–r noise characteristic frequency has only a slight change.
In this work,we present a theoretical and experimental study on the drain current 1/f noise in the AlGaN/GaN high electron mobility transistor(HEMT).Based on both mobility fluctuation and carrier number fluctuation in a twodimensional electron gas(2DEG)channel of AlGaN/GaN HEMT,a unified drain current 1/f noise model containing a piezoelectric polarization effect and hot carrier effect is built.The drain current 1/f noise induced by the piezoelectric polarization effect is distinguished from that induced by the hot carrier effect through experiments and simulations.The simulation results are in good agreement with the experimental results.Experiments show that after hot carrier injection,the drain current 1/f noise increases four orders of magnitude and the electrical parameter degradation gm/gmreaches54.9%.The drain current 1/f noise degradation induced by the piezoelectric effect reaches one order of magnitude;the electrical parameter degradation gm/gmis 11.8%.This indicates that drain current 1/f noise of the GaN-based HEMT device is sensitive to the hot carrier effect and piezoelectric effect.This study provides a useful reliability characterization tool for the AlGaN/GaN HEMTs.
Trap-assisted tunneling(TAT) has attracted more and more attention, because it seriously affects the sub-threshold characteristic of tunnel field-effect transistor(TFET). In this paper, we assess subthreshold performance of double gate TFET(DG-TFET) through a band-to-band tunneling(BTBT) model, including phonon-assisted scattering and acoustic surface phonons scattering. Interface state density profile(D_(it)) and the trap level are included in the simulation to analyze their effects on TAT current and the mechanism of gate leakage current.
It is found that ionizing-radiation can lead to the base current and the 1/f noise degradations in PNP bipolar junction transistors. In this paper, it is suggested that the surface of the space charge region of the emitter-base junction is the main source of the base surface 1/f noise. A model is developed which identifies the parameters and describes their interactive contributions to the recombination current at the surface of the space charge region. Based on the theory of carrier number fluctuation and the model of surface recombination current, a 1/f noise model is developed. This model suggests that 1/f noise degradations are the result of the accumulation of oxide-trapped charges and interface states. Combining models of ELDRS, this model can explain the reason why the 1/f noise degradation is more severe at a low dose rate than at a high dose rate. The radiations were performed in a Co^(60) source up to a total dose of 700 Gy(Si). The low dose rate was 0.001 Gy(Si)/s and the high dose rate was 0.1 Gy(Si)/s. The model accords well with the experimental results.
