Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are gen- erally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and com-pact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reac-tion between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume frac-tion in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes frac- tions above 20%, the joint strengths decrease.
为了提高Si3N4陶瓷连接接头高温性能及减小接头因热膨胀系数不匹配而产生的应力,采用Ag Cu Ti钎料和NiTi复合中间层进行半固态连接。接头组织观察表明,钎缝主要由NiTi(Cu)金属间化合物和Ag Cu基体组成。研究表明,Ni与Ti的加入量对于钎缝中金属间化合物的形态及钎缝与母材界面反应层的形成具有十分重要的影响。
