A model coupling particle aggregation and randomwalk surface diffusion has been developed for 2D simulation of depositional growth, in which impinging particles follow either a straight-line trajectory of cosine distribution, representing typically sputter deposition, or a scattered trajectory, representing typically electrochemical deposition. Simulations of the growth under various impinging conditions and effective surface diffusivity have been carried out. Pattern and defect development in deposition on flat, trenched and ridged substrates have been investigated. We found that on flat and ridged substrates, both types of trajectories yield similar features, including formation of cone-like defects on surface ridges. While on trenched substrate, the straight-line impingement yielded more uniform step coverage than the scattered impingement.
