您的位置: 专家智库 > >

国家自然科学基金(61176100)

作品数:6 被引量:2H指数:1
相关作者:汪礼胜徐静平朱述炎刘璐叶青更多>>
相关机构:华中科技大学武汉理工大学更多>>
发文基金:国家自然科学基金更多>>
相关领域:电子电信化学工程更多>>

文献类型

  • 6篇中文期刊文章

领域

  • 6篇电子电信
  • 1篇化学工程

主题

  • 2篇HFO
  • 2篇MOSFET
  • 2篇INGAAS
  • 2篇GAAS
  • 2篇NMOSFE...
  • 1篇钝化层
  • 1篇栅介质
  • 1篇散射
  • 1篇散射机理
  • 1篇态密度
  • 1篇迁移
  • 1篇迁移率
  • 1篇界面态
  • 1篇界面态密度
  • 1篇金属-氧化物...
  • 1篇高K栅介质
  • 1篇半导体
  • 1篇PHYSIC...
  • 1篇PMOSFE...
  • 1篇STACK

机构

  • 3篇华中科技大学
  • 1篇武汉理工大学

作者

  • 2篇朱述炎
  • 2篇徐静平
  • 2篇汪礼胜
  • 1篇刘璐
  • 1篇黄苑
  • 1篇叶青

传媒

  • 2篇Journa...
  • 1篇物理学报
  • 1篇电子学报
  • 1篇微电子学
  • 1篇Chines...

年份

  • 1篇2017
  • 2篇2016
  • 1篇2014
  • 2篇2013
6 条 记 录,以下是 1-6
排序方式:
A physical model of hole mobility for germanium-on-insulator pMOSFETs被引量:1
2016年
A physical model of hole mobility for germanium-on-insulator p MOSFETs is built by analyzing all kinds of scattering mechanisms, and a good agreement of the simulated results with the experimental data is achieved, confirming the validity of this model. The scattering mechanisms involved in this model include acoustic phonon scattering, ionized impurity scattering, surface roughness scattering, coulomb scattering and the scattering caused by Ge film thickness fluctuation. The simulated results show that the coulomb scattering from the interface charges is responsible for the hole mobility degradation in the low-field regime and the surface roughness scattering limits the hole mobility in the high-field regime. In addition, the effects of some factors, e.g. temperature, doping concentration of the channel and the thickness of Ge film, on degradation of the mobility are also discussed using the model, thus obtaining a reasonable range of the relevant parameters.
袁文宇徐静平刘璐黄勇程智翔
高k栅介质InGaAs MOSFET结构的设计与仿真
2014年
利用半导体仿真工具Silvaco TCAD,研究了高k栅介质InGaAs MOSFET的三种结构:缓冲层结构、侧墙结构和基本结构。通过对三种结构MOSFET的阈值电压、亚阈值摆幅以及漏源电流进行比较分析,得出缓冲层结构InGaAs MOSFET具有最佳的电学特性,侧墙结构的MOSFET次之。进一步分析发现,当缓冲层结构InGaAs MOSFET的沟道厚度大于80nm时,可获得稳定的电性能。
朱述炎叶青汪礼胜徐静平
关键词:MOSFETINGAAS高K栅介质
Improved interface properties of an HfO_2 gate dielectric GaAs MOS device by using SiN_x as an interfacial passivation layer
2013年
A GaAs metal-oxide-semiconductor (MOS) capacitor with HfO2 as gate dielectric and silicon nitride (SiNx) as the interlayer (IL) is fabricated. Experimental results show that the sample with the SiNx IL has an improved capacitance- voltage characteristic, lower leakage current density (0.785 × 10^-6 Alcm^2 at Vfo + 1 V) and lower interface-state density (2.9 × 10^12 eV^-1 ·cm^-2) compared with other samples with N2- or NH3-plasma pretreatment. The influences of post- deposition annealing temperature on electrical properties are also investigated for the samples with SiNx IL. The sample annealed at 600 ℃ exhibits better electrical properties than that annealed at 500 ℃, which is attributed to the suppression of native oxides, as confirmed by XPS analyses.
朱述炎徐静平汪礼胜黄苑
关键词:INTERLAYER
不同散射机理对Al_2O_3/In_xGa_(1-x)As nMOSFET反型沟道电子迁移率的影响
2013年
通过考虑体散射、界面电荷的库仑散射以及Al2O3/InxGa1-xAs界面粗糙散射等主要散射机理,建立了以Al2O3为栅介质InxGa1-xAsn沟金属-氧化物-半导体场效应晶体管(nMOSFETs)反型沟道电子迁移率模型,模拟结果与实验数据有好的符合.利用该模型分析表明,在低至中等有效电场下,电子迁移率主要受界面电荷库仑散射的影响;而在强场下,电子迁移率则取决于界面粗糙度散射.降低界面态密度,减小Al2O3/InxGa1-xAs界面粗糙度,适当提高In含量并控制沟道掺杂在合适值是提高InGaAs nMOSFETs反型沟道电子迁移率的主要途径.
黄苑徐静平汪礼胜朱述炎
关键词:INGAASMOSFET散射机理
YON界面钝化层改善HfO_(2)/Ge界面特性的研究被引量:1
2017年
本文采用YON界面钝化层来改善HfO_2栅介质Ge metal-oxide-semiconductor(MOS)器件的界面质量和电特性.比较研究了两种不同的YON制备方法:在Ar+N_2氛围中溅射Y_2O_3靶直接淀积获得以及先在Ar+N_2氛围中溅射Y靶淀积YN再于含氧氛围中退火形成YON.实验结果及XPS的分析表明,后者可以利用YN在退火过程中先于Ge表面吸收从界面扩散的O而氧化,从而阻挡了O扩散到达Ge表面,更有效抑制了界面处Ge氧化物的形成,获得了更优良的界面特性和电特性:较小的CET(1.66 nm),较大的k值(18.8),较低的界面态密度(7.79×10^(11)e V^(-1)cm^(-2))和等效氧化物电荷密度(-4.83×10^(12)cm^(-2)),低的栅极漏电流(3.40×10^(-4)A/cm^2@V_g=V_(fb)+1 V)以及好的高场应力可靠性.
程智翔徐钦刘璐
关键词:界面态密度
A threshold-voltage model for small-scaled GaAs nMOSFET with stacked high-k gate dielectric
2016年
A threshold-voltage model for a stacked high-k gate dielectric GaAs MOSFET is established by solving a two-dimensional Poisson's equation in channel and considering the short-channel, DIBL and quantum effects. The simulated results are in good agreement with the Silvaco TCAD data, confirming the correctness and validity of the model. Using the model, impacts of structural and physical parameters of the stack high-k gate dielectric on the threshold-voltage shift and the temperature characteristics of the threshold voltage are investigated. The results show that the stacked gate dielectric structure can effectively suppress the fringing-field and DIBL effects and improve the threshold and temperature characteristics, and on the other hand, the influence of temperature on the threshold voltage is overestimated if the quantum effect is ignored.
刘超文徐静平刘璐卢汉汉黄苑
共1页<1>
聚类工具0