The deposition of silicon dioxide by plasma enhanced chemical vapor deposition from tetraethylorthosilicate (TEOS) and H_2O has been studied.Silicon oxide with refractive index of 1453 has been obtained.Tests on the 51mm wafers show that both thickness uniformity of ±15% and constant refractive index of 1453 can be achieved.By raising the deposition temperature,the qualities have been improved,while the deposition rate decreased.A SiO_2 thick film deposition technique has been developed combining TEOS-PECVD technique with high temperature annealing.
